{"id":2626,"date":"2026-10-01T11:00:00","date_gmt":"2026-10-01T03:00:00","guid":{"rendered":"https:\/\/www.jccncmachining.com\/?p=2626"},"modified":"2026-10-08T14:42:32","modified_gmt":"2026-10-08T06:42:32","slug":"semiconductor-equipment-cnc-machining","status":"publish","type":"post","link":"https:\/\/www.jccncmachining.com\/fr\/blog\/semiconductor-equipment-cnc-machining\/","title":{"rendered":"Une dimension parfaite peut encore contaminer l'outil"},"content":{"rendered":"<article style=\"font-size: 16px; line-height: 1.85;\">A semiconductor-equipment part can meet every dimensional callout and still fail in service. Residual cutting fluid, trapped abrasive, burrs, unsuitable material, surface damage, virtual leaks, or contaminated packaging can compromise vacuum performance and process cleanliness. CNC machining for semiconductor equipment therefore has two parallel outputs: controlled geometry and controlled product condition.<\/p>\n<p>This article follows contamination backward from the installed tool to material, design, machining, cleaning, inspection, and packaging. It avoids universal cleanliness or vacuum limits because acceptance must come from the equipment program and process environment.<\/p>\n<nav class=\"article-toc\" style=\"margin: 28px 0; padding: 22px 26px; border: 1px solid #e4e4e4; border-radius: 8px; background: #fafafa;\" aria-label=\"Table des mati\u00e8res\"><strong style=\"display: block; font-size: 21px; margin-bottom: 10px;\">Table des mati\u00e8res<\/strong><\/p>\n<ol style=\"margin: 0; padding-left: 22px;\">\n<li><a href=\"#two-specifications\">Every part carries two specifications<\/a><\/li>\n<li><a href=\"#contamination-map\">Build a contamination map<\/a><\/li>\n<li><a href=\"#vacuum-design\">Geometry can trap process residue<\/a><\/li>\n<li><a href=\"#material-finish\">Material and finish compatibility<\/a><\/li>\n<li><a href=\"#machining-controls\">Machining controls before cleaning<\/a><\/li>\n<li><a href=\"#clean-inspect-pack\">Clean, inspect, and pack as one route<\/a><\/li>\n<li><a href=\"#documentation\">Documentation that preserves status<\/a><\/li>\n<li><a href=\"#risk-review\">Semiconductor part risk review<\/a><\/li>\n<li><a href=\"#faq\">Equipment-part FAQs<\/a><\/li>\n<\/ol>\n<\/nav>\n<section id=\"two-specifications\">\n<h2 style=\"font-size: 28px; line-height: 1.3; margin: 42px 0 18px;\">Every Part Carries Two Specifications<\/h2>\n<p><img decoding=\"async\" width=\"1024\" height=\"576\" loading=\"lazy\" src=\"https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-1-every-part-carries-two-specifications-1024x576.webp\" alt=\"every-part-carries-two-specifications\" class=\"size-large wp-image-2782 aligncenter\" \/>\nThe geometry specification defines dimensions, datums, surface texture, threads, sealing interfaces, and fits. The product-condition specification defines material identity, surface chemistry, cleanliness, allowed residues, handling, packaging, and traceability. Both must be translated into supplier instructions.\n\nA generic note such as \u201cclean for semiconductor use\u201d is not enough. Define the applicable customer standard, prohibited substances, cleaning validation, inspection method, packaging environment, and shelf or handling conditions. Requirements can differ between vacuum chamber, gas delivery, wet process, wafer handling, and external structural equipment.\n\n<\/section>\n<section id=\"contamination-map\">\n<h2 style=\"font-size: 28px; line-height: 1.3; margin: 42px 0 18px;\">Build a Contamination Map Before Process Planning<\/h2>\n<p>List every stage that can add particles, films, ions, moisture, fibers, or cross-material residue: incoming stock, sawing, coolant, cutting tools, deburring, blasting, polishing, heat treatment, anodizing, passivation, inspection fixtures, washing, drying, gloves, bags, and transport.<\/p>\n<table style=\"width: 100%; border-collapse: collapse; margin: 22px 0;\">\n<thead>\n<tr>\n<th style=\"border: 1px solid #ddd; padding: 12px; text-align: left; background: #f3f3f3;\">Source<\/th>\n<th style=\"border: 1px solid #ddd; padding: 12px; text-align: left; background: #f3f3f3;\">Effet potentiel<\/th>\n<th style=\"border: 1px solid #ddd; padding: 12px; text-align: left; background: #f3f3f3;\">Control question<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td style=\"border: 1px solid #ddd; padding: 12px;\">Blind holes and threads<\/td>\n<td style=\"border: 1px solid #ddd; padding: 12px;\">Trapped fluid or particles<\/td>\n<td style=\"border: 1px solid #ddd; padding: 12px;\">Can they drain, flush, dry, and be inspected?<\/td>\n<\/tr>\n<tr>\n<td style=\"border: 1px solid #ddd; padding: 12px;\">Shared media or tools<\/td>\n<td style=\"border: 1px solid #ddd; padding: 12px;\">Cross-material contamination<\/td>\n<td style=\"border: 1px solid #ddd; padding: 12px;\">Is segregation or dedicated media required?<\/td>\n<\/tr>\n<tr>\n<td style=\"border: 1px solid #ddd; padding: 12px;\">Manual edge finishing<\/td>\n<td style=\"border: 1px solid #ddd; padding: 12px;\">Loose burrs or embedded abrasive<\/td>\n<td style=\"border: 1px solid #ddd; padding: 12px;\">What method and acceptance apply?<\/td>\n<\/tr>\n<tr>\n<td style=\"border: 1px solid #ddd; padding: 12px;\">Packaging<\/td>\n<td style=\"border: 1px solid #ddd; padding: 12px;\">Recontamination after release<\/td>\n<td style=\"border: 1px solid #ddd; padding: 12px;\">Where and how is final bagging performed?<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/section>\n<section id=\"vacuum-design\">\n<h2 style=\"font-size: 28px; line-height: 1.3; margin: 42px 0 18px;\">Geometry Can Trap Process Residue and Gas<\/h2>\n<p><img decoding=\"async\" width=\"1024\" height=\"576\" loading=\"lazy\" src=\"https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-3-geometry-can-trap-process-residue-1024x576.webp\" alt=\"geometry-can-trap-process-residue\" class=\"size-large wp-image-2774 aligncenter\" \/>\nBlind tapped holes, overlapping passages, porous surface conditions, narrow crevices, and inaccessible cross-holes can be difficult to wash and dry. In vacuum duty, trapped volume or residue may appear as a leak-like load. Design review should consider venting, drain orientation, thread form, seals, welds, and cleanability.\n\nSealing faces need suitable flatness, texture, edge condition, and protection. A dimensionally correct scratch across a seal path can be functionally unacceptable. Identify sealing zones on the drawing and preserve them through finishing, inspection, and packaging.\n\n<\/section>\n<section id=\"material-finish\">\n<h2 style=\"font-size: 28px; line-height: 1.3; margin: 42px 0 18px;\">Material and Finish Compatibility Belong to the Process Environment<\/h2>\n<p><img decoding=\"async\" width=\"1024\" height=\"576\" loading=\"lazy\" src=\"https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-4-material-finish-compatibility-belong-process-1024x576.webp\" alt=\"material-finish-compatibility-belong-process\" class=\"size-large wp-image-2775 aligncenter\" \/>\nAluminum, stainless steels, engineering plastics, copper alloys, and specialty materials may all appear in semiconductor equipment, but suitability depends on vacuum, plasma, chemical exposure, temperature, wear, and contamination limits. Specify grade, condition, certification, and any restricted substitutions.\n\nAnodizing, electropolishing, passivation, plating, polishing, or specialty coatings can change corrosion, particle behavior, reflectivity, conductivity, and cleanability. Masking and contact marks must be controlled. Review finish thickness against fits and seal geometry through the <a href=\"https:\/\/www.jccncmachining.com\/fr\/blog\/finition-de-surface-en-usinage-cnc\/\" srcset=\"https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-4-material-finish-compatibility-belong-process-1024x576.webp 1024w, https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-4-material-finish-compatibility-belong-process-300x169.webp 300w, https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-4-material-finish-compatibility-belong-process-768x432.webp 768w, https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-4-material-finish-compatibility-belong-process-1536x864.webp 1536w, https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-4-material-finish-compatibility-belong-process-18x10.webp 18w, https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-4-material-finish-compatibility-belong-process-800x450.webp 800w, https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-4-material-finish-compatibility-belong-process.webp 1600w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/>CNC surface-finish<\/a> plan.<\/p>\n<\/section>\n<section id=\"machining-controls\">\n<h2 style=\"font-size: 28px; line-height: 1.3; margin: 42px 0 18px;\">Machining Controls Begin Before the Wash<\/h2>\n<p><img decoding=\"async\" width=\"1024\" height=\"576\" loading=\"lazy\" src=\"https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-5-machining-controls-begin-wash-1024x576.webp\" alt=\"machining-controls-begin-wash\" class=\"size-large wp-image-2776 aligncenter\" \/>\nCleaning cannot reliably repair every upstream problem. Prevent smeared burrs, embedded chips, damaged threads, inaccessible residue, and mixed-material debris during machining. Control tool condition, coolant quality, chip evacuation, handling surfaces, and deburring methods.\n\nLarge plates, chamber components, and thin vacuum parts may move with residual stress or clamping. Sequence roughing, relaxation, and finishing around functional datums. Protect finished sealing faces and avoid marker, adhesive, or handling materials prohibited by the program.\n\nThe applicable <a href=\"https:\/\/www.jccncmachining.com\/fr\/blog\/controle-qualite-de-lusinage-cnc\/\" srcset=\"https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-5-machining-controls-begin-wash-1024x576.webp 1024w, https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-5-machining-controls-begin-wash-300x169.webp 300w, https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-5-machining-controls-begin-wash-768x432.webp 768w, https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-5-machining-controls-begin-wash-1536x864.webp 1536w, https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-5-machining-controls-begin-wash-18x10.webp 18w, https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-5-machining-controls-begin-wash-800x450.webp 800w, https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-5-machining-controls-begin-wash.webp 1600w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/>quality-control workflow<\/a> should include product condition, not only final dimensions.<\/p>\n<\/section>\n<section id=\"clean-inspect-pack\">\n<h2 style=\"font-size: 28px; line-height: 1.3; margin: 42px 0 18px;\">Clean, Inspect, and Pack as One Route<\/h2>\n<p><img decoding=\"async\" width=\"1024\" height=\"576\" loading=\"lazy\" src=\"https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-6-clean-inspect-pack-as-one-1024x576.webp\" alt=\"clean-inspect-pack-as-one\" class=\"size-large wp-image-2777 aligncenter\" \/>\nDefine pre-clean preparation, chemistry, water quality if applicable, agitation or ultrasonic restrictions, rinse, drying, inspection, environmental controls, and packaging. Process order matters: some inspections can contaminate a cleaned surface, while some cleaning steps can alter markings or finishes.\n\nVisual inspection needs agreed lighting, magnification, and defect criteria. Particle, residue, leak, or surface tests must follow the program\u2019s defined method. Package immediately after release using approved materials and identification. A clean part placed on an uncontrolled bench is no longer in the same condition.\n\n<\/section>\n<section id=\"documentation\">\n<h2 style=\"font-size: 28px; line-height: 1.3; margin: 42px 0 18px;\">Documentation Preserves Product Status<\/h2>\n<p><img decoding=\"async\" width=\"1024\" height=\"576\" loading=\"lazy\" src=\"https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-7-documentation-preserves-product-status-1024x576.webp\" alt=\"documentation-preserves-product-status\" class=\"size-large wp-image-2778 aligncenter\" \/>\nRecords may include material certification, lot and revision, special-process certificates, dimensional results, cleaning batch, inspection status, packaging date, and nonconformance history. The required package varies, but traceability should connect the sealed package to the accepted process route.\n\nSupplier changes in material source, coolant, cleaning chemistry, finishing source, packaging, or facility can affect product condition. Define notification and revalidation requirements. The site\u2019s <a href=\"https:\/\/www.jccncmachining.com\/fr\/a-propos\/qualite\/\" srcset=\"https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-7-documentation-preserves-product-status-1024x576.webp 1024w, https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-7-documentation-preserves-product-status-300x169.webp 300w, https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-7-documentation-preserves-product-status-768x432.webp 768w, https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-7-documentation-preserves-product-status-1536x864.webp 1536w, https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-7-documentation-preserves-product-status-18x10.webp 18w, https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-7-documentation-preserves-product-status-800x450.webp 800w, https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-7-documentation-preserves-product-status.webp 1600w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/>qualit\u00e9<\/a> can support capability review, while controlled project documents define acceptance.<\/p>\n<\/section>\n<section id=\"risk-review\">\n<h2 style=\"font-size: 28px; line-height: 1.3; margin: 42px 0 18px;\">Semiconductor Part Risk Review<\/h2>\n<p><img decoding=\"async\" width=\"1024\" height=\"576\" loading=\"lazy\" src=\"https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-8-semiconductor-part-risk-review-1024x576.webp\" alt=\"semiconductor-part-risk-review\" class=\"size-large wp-image-2779 aligncenter\" \/>\n<ul srcset=\"https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-8-semiconductor-part-risk-review-1024x576.webp 1024w, https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-8-semiconductor-part-risk-review-300x169.webp 300w, https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-8-semiconductor-part-risk-review-768x432.webp 768w, https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-8-semiconductor-part-risk-review-1536x864.webp 1536w, https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-8-semiconductor-part-risk-review-18x10.webp 18w, https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-8-semiconductor-part-risk-review-800x450.webp 800w, https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-8-semiconductor-part-risk-review.webp 1600w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/>\n<li>Where does the part contact process gas, vacuum, wafer, fluid, optics, or sensitive assemblies?<\/li>\n<li>Which cavities, holes, threads, and passages are difficult to clean or inspect?<\/li>\n<li>Which materials, coolants, abrasives, markers, and packaging are prohibited?<\/li>\n<li>Which surfaces seal, ground, transfer heat, or control alignment?<\/li>\n<li>What happens after cleaning, and can any step recontaminate the part?<\/li>\n<li>What evidence releases the lot, and how is package status preserved?<\/li>\n<\/ul>\n<p>This application-specific review extends the parent <a href=\"https:\/\/www.jccncmachining.com\/fr\/blog\/applications-dusinage-cnc\/\">applications de l'usinage CNC<\/a> overview into contamination-sensitive equipment.<\/p>\n<\/section>\n<section id=\"faq\">\n<h2 style=\"font-size: 28px; line-height: 1.3; margin: 42px 0 18px;\">Equipment-Part FAQs<\/h2>\n<p><img decoding=\"async\" width=\"1024\" height=\"576\" loading=\"lazy\" src=\"https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-9-semiconductor-cnc-machining-engineering-questions-1024x576.webp\" alt=\"semiconductor-cnc-machining-engineering-questions\" class=\"size-large wp-image-2780 aligncenter\" \/>\n<h3 style=\"font-size: 22px; line-height: 1.4; margin: 26px 0 10px;\" srcset=\"https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-9-semiconductor-cnc-machining-engineering-questions-1024x576.webp 1024w, https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-9-semiconductor-cnc-machining-engineering-questions-300x169.webp 300w, https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-9-semiconductor-cnc-machining-engineering-questions-768x432.webp 768w, https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-9-semiconductor-cnc-machining-engineering-questions-1536x864.webp 1536w, https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-9-semiconductor-cnc-machining-engineering-questions-18x10.webp 18w, https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-9-semiconductor-cnc-machining-engineering-questions-800x450.webp 800w, https:\/\/www.jccncmachining.com\/wp-content\/uploads\/2026\/09\/h2-9-semiconductor-cnc-machining-engineering-questions.webp 1600w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/>Does a cleanroom guarantee a clean part?<\/h3>\n<p>No. Facility classification is only one factor. The machining, cleaning, handling, inspection, packaging, and test methods must meet the project\u2019s defined product-condition requirements.<\/p>\n<h3 style=\"font-size: 22px; line-height: 1.4; margin: 26px 0 10px;\">Can every burr be removed after machining?<\/h3>\n<p>Accessible burrs can be controlled, but intersecting passages and hidden features may be difficult to verify. Design and process planning should reduce burr creation and improve access.<\/p>\n<h3 style=\"font-size: 22px; line-height: 1.4; margin: 26px 0 10px;\">Should dimensions be checked before or after cleaning?<\/h3>\n<p>It depends on the feature and method. The process plan must prevent measurement from recontaminating the released part and confirm whether finishing or cleaning changes the measured condition.<\/p>\n<\/section>\n<aside aria-label=\"Semiconductor manufacturing note\">\n<h3 style=\"font-size: 22px; line-height: 1.4; margin: 26px 0 10px;\">Control geometry and contamination together<\/h3>\n<p>Flatness and geometry requirements should state the support and thermal condition used for verification. Large vacuum plates, frames, and chamber components can sag under their own weight or respond to uneven clamping. Fixture, orientation, soak time, and measurement temperature determine whether data from different facilities can be compared.<\/p>\n<p>Special processes need the same revision discipline as machining. Electropolishing, anodizing, passivation, plating, welding, and vacuum cleaning can alter dimensions, texture, chemistry, or trapped residue. Define sequence, masking, rack-contact zones, rinse access, evidence, and rework limits before outside processing.<\/p>\n<p>A supplier audit should follow the part&#8217;s status path from incoming material through machining, deburring, protection, cleaning, inspection, bagging, and shipment. The goal is proof that a released part cannot be confused with an unfinished or nonconforming one.<\/p>\n<p>When contamination occurs, preserve samples and lot history before recleaning. Particle type, location, morphology, and chemistry can distinguish cutting debris from packaging fibers, dried cleaner, handling residue, or assembly contamination.<\/p>\n<\/aside>\n<aside aria-label=\"Vacuum component controls\">\n<h3 style=\"font-size: 22px; line-height: 1.4; margin: 26px 0 10px;\">Treat hidden surfaces as functional surfaces<\/h3>\n<p>Blind holes, intersecting passages, weld backsides, deep pockets, and threaded cavities can retain chips, polishing media, cleaner, or moisture. Review each feature for tool access, deburring access, rinse direction, drainage, drying, and inspection. If a surface cannot be reached or verified, redesign, qualify a dedicated process, or document why the risk is acceptable.<\/p>\n<p>Vacuum and sealing performance depend on more than nominal roughness. Scratches crossing a seal, embedded abrasive, rolled edges, damaged knife features, and waviness can create failure while average Ra remains acceptable. Mark sealing and vacuum-facing zones on the drawing and define handling protection from machining through packaging.<\/p>\n<p>Packaging should preserve the verified state. Specify final cleaning location, double-bagging or protective wrapping where appropriate, cap and plug materials, label placement, and the clean environment in which the package may be opened. A clean report loses value if cardboard dust, foam debris, or unprotected handling reaches the part afterward.<\/p>\n<p>For repeat programs, trend contamination findings and dimensional drift by route, machine, process lot, and cleaning batch. Recurring particles or residues should trigger process investigation rather than progressively stronger final cleaning.<\/p>\n<\/aside>\n<\/article>","protected":false},"excerpt":{"rendered":"<p>A semiconductor-equipment part can meet every dimensional callout and still fail in service. Residual cutting fluid, trapped abrasive, burrs, unsuitable material, surface damage, virtual leaks, or contaminated packaging can compromise vacuum performance and process cleanliness. CNC machining for semiconductor equipment therefore has two parallel outputs: controlled geometry and controlled product condition. This article follows contamination [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":2781,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[1],"tags":[],"class_list":["post-2626","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog"],"_links":{"self":[{"href":"https:\/\/www.jccncmachining.com\/fr\/wp-json\/wp\/v2\/posts\/2626","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.jccncmachining.com\/fr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.jccncmachining.com\/fr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.jccncmachining.com\/fr\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.jccncmachining.com\/fr\/wp-json\/wp\/v2\/comments?post=2626"}],"version-history":[{"count":12,"href":"https:\/\/www.jccncmachining.com\/fr\/wp-json\/wp\/v2\/posts\/2626\/revisions"}],"predecessor-version":[{"id":2783,"href":"https:\/\/www.jccncmachining.com\/fr\/wp-json\/wp\/v2\/posts\/2626\/revisions\/2783"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.jccncmachining.com\/fr\/wp-json\/wp\/v2\/media\/2781"}],"wp:attachment":[{"href":"https:\/\/www.jccncmachining.com\/fr\/wp-json\/wp\/v2\/media?parent=2626"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.jccncmachining.com\/fr\/wp-json\/wp\/v2\/categories?post=2626"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.jccncmachining.com\/fr\/wp-json\/wp\/v2\/tags?post=2626"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}